FR4 PCB

What is FR4?

FR4 is a composite material made from woven fiberglass cloth combined with an epoxy resin binder. It is one of the most common base materials used in printed circuit boards (PCBs). The “FR” stands for “flame retardant,” and the “4” refers to its grade for flame resistance.

FR4 is an essential material in nearly every PCB because of its affordability and ease of use. Understanding its properties ensures you choose the best material for your specific PCB manufacturing needs. At Mars PCB, we help you design and manufacture top-quality PCBs tailored to your application.

How is FR4 Used in the PCB Industry?

Primary Insulating Material

FR4 serves as the primary insulating substrate in PCBs, providing a strong base to support copper traces that form the circuits. This fiberglass-reinforced material is known for its mechanical strength and excellent electrical insulation, ensuring reliable PCB performance.

Copper Lamination

FR4 sheets are bonded with copper foil using heat and adhesive, creating a strong and durable connection. The copper layers are etched to create the desired circuit patterns. This process allows for the creation of single-sided, double-sided, or multilayer boards.

Multilayer PCBs

Multiple FR4 layers, along with copper, are laminated together with insulating prepreg materials, enabling the creation of intricate and high-density circuits for advanced electronics.


Surface Finishing

After copper etching, a protective solder mask is applied to prevent oxidation and solder bridges during assembly. Common surface finishes include HASL (Hot Air Solder Leveling), ENIG (Electroless Nickel Immersion Gold), and OSP (Organic Solderability Preservatives).

Halogen-Free PCBs

Standard FR4

The most commonly used material, offering a balanced mix of mechanical, electrical, and thermal properties. With a glass transition temperature (Tg) of around 130°C to 140°C, it's suitable for general-purpose applications.

High Tg FR4

This version is designed for high-temperature environments, with a Tg between 170°C and 180°C. It’s ideal for high-power and high-reliability applications like automotive systems and power electronics.

High-Frequency FR4

This material is optimized for RF and microwave use, with a lower dielectric constant and dissipation factor. It minimizes signal attenuation and enhances signal integrity in telecommunications, aerospace, and radar systems.

High CTI FR4

High Comparative Tracking Index (CTI) FR4 offers superior resistance to electrical breakdown and better thermal conductivity. It's perfect for applications requiring quick heat dissipation, such as power supplies and industrial electronics.

G10

Known for its toughness and high resistance to thermal shock, G10 is used where robust mechanical and dielectric properties are needed. While FR4 is flame retardant, G10 is not.

Rogers PCB Applications

FR4 substrates offer important qualities that make them versatile for many electronic applications.

Dielectric Properties of FR4

In FR4, the dielectric constant (Dk) measures the material’s ability to store electrical energy in an electric field. The dielectric constant affects how fast electrical signals can travel through the material.

A stable dielectric constant is crucial for maintaining signal integrity, especially in high-frequency applications. This ensures consistent signal propagation and reduces signal loss.

Typical Dielectric Constant Values

FR4 typically has a dielectric constant (Dk) ranging from 3.9 to 4.8. Depending on the manufacturing process, slight variations may occur. Key impacts of this Dk include:

Factors Affecting Dielectric Constant

The dielectric constant can vary based on several factors:

Thermal Properties of FR4

Glass Transition Temperature (Tg)

The Tg of FR4 indicates the temperature range where it transitions from a rigid to a more flexible state. Typically, this range is from 130°C to 180°C. Exceeding this temperature can compromise the material’s properties and cause failure.

Coefficient of Thermal Expansion

The CTE measures how much FR4 expands with temperature. FR4’s low CTE ensures stability during temperature fluctuations, but it increases above Tg. This can cause mechanical stress in applications with high thermal demands.

Thermal Conductivity

FR4 has relatively low thermal conductivity, typically between 0.25 to 0.4 W/m·K. This means it doesn't dissipate heat as efficiently, so thermal management strategies such as heat sinks and vias are crucial.

Surface Finishing

After copper etching, a protective solder mask is applied to prevent oxidation and solder bridges during assembly. Common surface finishes include HASL (Hot Air Solder Leveling), ENIG (Electroless Nickel Immersion Gold), and OSP (Organic Solderability Preservatives).

Mechanical Properties of FR4

FR4 vs. Rogers Material

Feature

FR4

Rogers Material

Composition

Woven fiberglass and epoxy resin

Ceramic-filled PTFE composite

Dielectric Constant (Dk)

4.2 to 4.6

2.2 to 10.2

Dissipation Factor (Df)

0.02 to 0.03

0.0009 to 0.002

Thermal Conductivity

Handles temperatures up to 130°C

Handles temperatures up to 280°C

Moisture Absorption

0.1 to 0.2%

0.02 to 0.08%

Advantages

Cost-effective, versatile, flame-resistant

Low signal loss, high-frequency stability

Disadvantages

Higher signal loss, lower thermal conductivity

Higher cost, complex fabrication

Applications

Consumer electronics, automotive, industrial

Aerospace, radar, microwave, high-frequency communication

Cost

Affordable

Higher cost

Tips to Select the Right FR4 Material

When choosing FR4 material for PCB fabrication, keep these factors in mind:

Professional PCB & PCB Assembly Manufacturer & Factory

FR4 is a popular choice for PCB design and assembly due to its versatility and performance. At Mars PCB, we help you select the best FR4 material for your needs, ensuring your circuit boards perform optimally for years.

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