PCB Assembly Capability
Printed Circuit Board Assembly Capability
Empowering your global electronics production needs with robust solutions—covering intricate PCB creation, parts procurement, comprehensive testing, and more.
Mars PCB provides a broad spectrum of electrical and electro-mechanical manufacturing services for both rigid and flexible circuits. From preliminary engineering input and surface-mount assembly to through-hole placement, streamlined manufacturing design (DFM) insights, test-oriented design (DFT) support, final packaging, and supply chain management, we aim to fulfill various project needs.
Ongoing investments in cutting-edge technology keep Mars PCB at the forefront of the industry, enabling us to excel in short-run orders and fast turnarounds. Our advanced 30,000-square-meter facilities house modern assembly lines, including dedicated clean zones that allow specialized production environments. Below is an outline of our PCB assembly range:
Surface Mount (SMT) Assembly | Through-Hole Assembly |
Mixed-Technology Builds | Rigid, Flex, and Rigid-Flex PCB Assembly |
Solder and PCB Cleaning | AOI Review |
X-Ray Verification | Functional Evaluations |
Rapid Prototyping | Repair and Upgrades |
Conformal Coating (e.g., Acrylic, Silicone) | Resin Potting Services |
Box-Level Integration | Components Procurement & Logistics |
SMT Assembly Capability Review
Component Range | Resistors, capacitors, diodes, SIPs, DIPs, integrated circuits, BGAs, LEDs, connectors, certain through-hole parts, etc. |
Component Dimensions (Min–Max) (W x L) | (About 0.254mm × 0.13mm up to 100mm × 45mm) |
Component Height (Min–Max) | (Approx. 0.005″ up to 2.00″) |
PCB Materials | Rigid, flex, rigid-flex, various metals, RF substrates, aluminum, etc. |
Solder Pastes | Lead-free alloys (such as 96.5%Sn/3.0%Ag/0.5%Cu) and no-clean options; Typical Brands: Alpha, Indium, Koki, etc. |
Solder Fluxes | Water-soluble, rosin-based, no-clean, and additional lead-free formulations. |
PCB Size (Min–Max) (W x L) | Minimum around 0.100″ × 0.100″ (using pallets) up to about 30″ × 30″ |
PCB Thickness (Min–Max) | From around 0.010″ up to 0.500″ |
Paste Inspection | 2D and laser-based checks |
Radial Insertion
Cycle Rate | Approx. 22,000 |
Component Categories | Capacitors, resistors, diodes, jumpers, etc. |
Component Dimensions | 0.300″ (minimum) – 0.950″ (maximum) |
Hole Span | Min. 0.100″ – Max. 0.460″ width |
Component Body Diameter | Min. 0.100″ – Max. 0.460″ |
Lead Wire Diameter | Min. 0.015″ – Max. 0.032″ |
PCB (Min–Max) (W x L) | 2″ × 2″ up to 22″ × 18.5″ |
Insertable Area | Approx. 20″ × 18.5″ |
Board Error Adjustment | Compensation features for layout deviations |
Verification System | Expandable verifier ensures correct component loading by the operator |
PCB Materials | Suitable for rigid, flex, rigid-flex, RF, CEM, aluminum boards |
DIP (Dual Inline-Pin Package) Insertion
Cycle Speed | Approx. 4,500 |
Component Types | .300 and .600 DIPs and matching sockets |
Component Dimensions (L×D×H) | Max around 0.512″ × 0.512″ × 0.906″ |
PCB (Min–Max) (W x L) | 2″ × 2″ up to 22″ × 18.5″ |
PCB Thickness (Min–Max) | Around 0.010″ up to 0.250″ |
Insertable Area | Approx. 20″ × 18.5″ |
Board Error Adjustment | Compensation for PCB pattern inconsistencies |
Verification System | Expandable verifier to maintain accurate component loading |
PCB Materials | Works with rigid, flex, rigid-flex, RF, CEM, aluminum boards |
Solder Processing
Solder Application Types | Manual station, wave soldering, selective solder, reflow |
Solder Alloys | Lead-free compositions (e.g., 96.5%Sn/3.0%Ag/0.5%Cu) |
Flux Types | VOC-free, water-soluble, rosin-based, no-clean, lead-free |
Flux Applicators | Ultrasonic, spray, drop-jet, foam, etc. |
PCB (Min–Max) (W x L) | Approx. 0.100″ × 0.100″ (pallet-based) up to 30″ × 30″ |
PCB Thickness (Min–Max) | From around 0.010″ up to 1″ |
PCB Base Materials | Suitable for rigid, flex, rigid-flex, RF, CEM, aluminum etc. |
AOI Inspection
Inspection Categories | 3D X-ray, Automated Optical Inspection (AOI) |
Magnification Levels | Up to about 255× |
Joint/Solder Check | Visual color-based and X-ray validation |
PCB Size Range (Min–Max) | Approx. 0.100″ × 0.100″ up to around 30″ × 30″ |
Functional Testing
Functional | Firmware programming, power-up checks, burn-in, and so on. |
Flying Probe | 24-probe system for boards up to around 35″ × 25″ |
RF | Signal sources, frequency analyzers, etc. |
Firmware Programming
System Platforms | Windows 7/10, macOS, Linux, etc. |
IC Support | ST, Atmel, TI, plus various families |
Repair & Upgrade Rework
Surface Mount (SMD) | Passive parts (down to 03015), processors, BGAs, etc. |
Through-Hole | Axial, radial, DIP, SIP, transformers, connectors, headers, |
Cable | Wire harnesses, flex assemblies, fiber optics, connectors |
PCB Restoration | Trace fixes, via rework, plated hole repairs, etc. |
Conformal Coating
Coating Substances | Acrylic, silicone, UV-based materials, etc. |
Automated Coating System | Precision spray and dispense equipment that handles both solvent and water-based materials with fine accuracy |
Substrate Dimensions (L×W) (Min–Max) | From about 2″×2″ to around 20″×20″ |
Substrate Height Limit | Up to 4″ |
Standard Thickness | Approx. 25–250μm (commonly around 50μm) |
Resin Potting
Potting Materials | Dual-component epoxies, urethane, silicone (conductive or non-conductive), underfills, etc. |
Box Build Assembly
Box-Level Integration | Cable routing, assembly, functional checks, labeling, logistics, etc. |
Components Procurement
Global Sourcing | Global channels for cost-effective acquisition |
Traceability | End-to-end component and final product tracking |
Quality Commitment | Only reputable, high-standard sources for PCBs, semiconductors, active/passive parts, electro-mechanical elements, and multilayer board builds. |