Blog
火星
11 10 月, 2026
Copper pillar and wire bonding place conflicting demands on one substrate pad frame: pad finish, via treatment, pitch limits and RFQ items to confirm.
Embedded passives in PCB design pay off when decoupling distance, board area or Z-height is the constraint. Process routes, tolerance and cost trade-offs.
See how chiplet and 2.5D/3D packaging change substrate and PCB requirements, from silicon interposers and RDL layers to CTE matching and warpage control.
Compare IC substrate and standard PCB capability: feature size, via formation, material systems, flatness and volume economics, plus how to classify a design.
How chiplet and 2.5D/3D packaging shift interconnect onto interposers and substrates, and what that changes for board stack-up, power delivery and release.
How ultra-thin copper foil down to 12µm improves etch geometry, where it is required for HDI and mSAP builds, and what it costs in handling and yield.
From concept to completion, your project will be under experienced project management, sparing you the hassle of untimely conference calls, communication gaps, language barriers and “real time” information gathering.
